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[Àü±â] Àü±â¾à¾î Á¤¸® |
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±Û¾´ÀÌ : ÃÖ°í°ü¸®ÀÚ °íÀ¯ID : admin
³¯Â¥ : 07-01-29 23:23
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Àü±â¾à¾î »çÀü
¢º ABC : Automatic Brightness Control (ÀÚµ¿ ÈÖµµ Á¶Àý) ¢º ABCC : Automatic Brightness and Contrast Control (ÀÚµ¿ ÈÖµµ ÄÜÆ®¶ó½ºÆ® Á¶Àý) ¢º AC : Alternating Current (±³·ù) ¢º ACAS : Airborne Collision Avoidance System (±â»ó Ãæµ¹ ¹æÁö ÀåÄ¡) ¢º ACB : Air-blast Circuit Breaker (°ø±â Â÷´Ü±â), Air Circuit Breaker (±âÁß Â÷´Ü±â) ¢º ACSR : Aluminum Cable Steel Reinforced (°½É ¾Ë·ç¹Ì´½ ¿¬¼±) ¢º ADC : Analog Digital Converter (¾Æ³ª·Î±× µðÁöÅ» º¯È¯±â) ¢º ADF : Automatic Direction Finder (ÀÚµ¿ ¹æÀ§ ÃøÁ¤±â) ¢º ADM : Adaptive Delta Modulation (ÀûÀÀ µ¨Å¸ º¯Á¶) ¢º ADPCM : Adaptive Differential Pulse Code Modulation (ÀûÀÀ Â÷µî ÆÞ½º ºÎÈ£ º¯Á¶¹æ½Ä) ¢º ADS : Automation Distribution System (¹èÀü ÀÚµ¿È ½Ã½ºÅÛ) ¢º AF : Audio Frequency (°¡Ã» ÁÖÆļö) ¢º AFC : Automation Frequency Control (ÀÚµ¿ ÁÖÆļö Á¦¾î) ¢º AFT : Automation Fine Tuning (ÀÚµ¿ ¼¼¹Ð Á¶Á¤) ¢º AGC : Automation Gain Control (ÀÚµ¿ À̵æ Á¦¾î) ¢º AI : Artificial Intelligence (Àΰø Áö´É) ¢º AM : Amplitude Modulation (ÁøÆø º¯Á¶) ¢º AMP : Ampere (¾ÏÆä¾î) ¢º ANSI : American National Standard Institute (¹Ì±¹ ±Ô°ÝÇùȸ) ¢º AP : Apparent Power (ÇÇ»ó Àü·Â) ¢º APF : Active Pass Filter (´Éµ¿ ÇÊÅÍ) ¢º ARQ : Automatic Request Question (ÀÚµ¿ ¿ÀÀÚ Á¤Á¤ ÀåÄ¡) ¢º ARS : Automatic Route Selection (ÀÚµ¿ °æ·Î ¼±ÅÃ) ¢º ARU : Audio Response Unit (À½¼º ÀÀ´ä ÀåÄ¡) ¢º ASIC : Application Specific IC (ÀÀ¿ë ÁÖ¹®Çü ÁýÀûȸ·Î) ¢º ASK : Amplitude Shift Keying (ÁøÆø À§»ó º¯Á¶) ¢º ASR : Automatic Send/Receive set(ÀÚµ¿ ¼Û¼ö½Å ÀåÄ¡) ¢º ATC : Automatic Train Control, Automatic Traffic Control (ÀÚµ¿ ¿Â÷ Á¦¾î, ÀÚµ¿ ±³Åë Á¦¾î) ¢º AVM : Automatic Vehicle Monitoring system (Â÷·® À§Ä¡ ¸ð´ÏÅ͸µ ½Ã½ºÅÛ) ¢º AVR : Automatic Voltage Regulator (ÀÚµ¿ Àü¾Ð Á¶Á¤±â)
B
¢º BA : Bridging Amplifier (ºÐ±â ÁõÆø±â) ¢º BAS : Building Automation System (ºôµù ÀÚµ¿È ½Ã½ºÅÛ) ¢º BSO : Bismuth Silicon Oxide (ºñ½º¹«Æ® ±Ô¼Ò »êȹ°) ¢º BTL : Balanced Transformerless (ºñƼ¿¤) ¢º BWO : Backward Wave Oscillator (ÈÄÁøÆÄ ¹ßÁø°ü)
C
¢º CAD : Computer Aided Design (ÄÄÇ»Å͸¦ ÀÌ¿ëÇÑ ¼³°è) ¢º CAE : Computer Aided Engineering (ÄÄÇ»Å͸¦ ÀÌ¿ëÇÑ ¿£Áö´Ï¾î¸µ) ¢º CAI : Computer Aided Instruction (ÄÄÇ»Å͸¦ ÀÌ¿ëÇÑ ÇнÀ) ¢º CAL : Computer Aided Learning (ÄÄÇ»Å͸¦ ÀÌ¿ëÇÑ ÇнÀ) ¢º CALS : Commerce at Light Speed ¢º CAM : Computer Aided Manufacturing (ÄÄÇ»Å͸¦ ÀÌ¿ëÇÑ Á¦Á¶) ¢º CAT : Computer Aided Testing, Computerized Axial Tomography (ÄÄÇ»Å͸¦ ÀÌ¿ëÇÑ °Ë»ç) ¢º CATV : Cable TV, Community Antenna TV (°øµ¿½Ãû TV) ¢º CAV : Constant Angular Velocity (Á¤ °¢¼Óµµ) ¢º CB : Citizen Band transceiver (»ýÈ° ¹«¼±) ¢º CCD : Charge Coupled Device (ÀüÇÏ °áÇÕ ¼ÒÀÚ) ¢º CCIR : International Radio Consultative Committee (±¹Á¦ ¹«¼±Åë½Å ÀÚ¹® À§¿øȸ) ¢º CCITT : International Telegraph and Telephone Consultative Committee (±¹Á¦Àü½ÅÀüÈ ÀÚ¹®À§¿øȸ) ¢º CCNR : Current Controlled Negative Resistance (Àü·ùÁ¦ÇÑ Ý¶ ÀúÇ×) ¢º CCTV : Closed Circuit TV (Æó¼âȸ·Î TV) ¢º CD-ROM : Compact Disk Read Only Memory ¢º CDK : Communication Deck (ȸ¼± °¨½Ã ÀåÄ¡) ¢º CDMA : Code Division Multiple Access (ºÎÈ£ ºÐÇÒ ´ÙÁß Á¢¼Ó) ¢º CDRX : Critical Damping Resistance External (ÀÓ°è Á¦µ¿ ¿ÜºÎÀúÇ×) ¢º CDT : Cyclic Digital Transmission (»çÀÌŬ¸¯ µðÁöÅÐ Á¤º¸ Àü¼Û) ¢º CEP : Circular Error Probable (È®·ü ¿ÀÂ÷¿ø) ¢º CFF : Critical Fusion Frequency (ÀÓ°è À¶ÇÕ ÁÖÆļö) ¢º CFRP : Carbonfiber Reinforced Plastics (ź¼Ò¼¶À¯ °È Çöó½ºÆ½) ¢º CIE : Commission International de I'Eclairage (±¹Á¦ Á¶¸í À§¿øȸ) ¢º CIM : Computer Integrated Manufacturing (ÄÄÇ»ÅÍ¿¡ ÀÇÇÑ ÅëÇÕ »ý»ê) ¢º CLV : Constant Linear Velocity (Á¤ ¼±¼Óµµ ¹æ½Ä) ¢º CML : Current Mode Logic (Àü·ù ³í¸® ¸ðµå) ¢º CMRR : Common Mode Rejection Ratio (µ¿»ó Àü¾Ð Á¦°Åºñ) ¢º CNC : Computer Numerical Control (ÄÄÇ»ÅÍ ¼öÄ¡ Á¦¾î) ¢º COAX : Coaxial Cable (µ¿Ãà ÄÉÀ̺í) ¢º CODEC : COder-DECoder (ºÎÈ£±â¿Í º¹È£±â) ¢º COHO : Coherent Oscillator (ÄÚÈ÷¾î·±Æ® ¹ßÁø±â) ¢º CRT : Cathode Ray Tube (À½±Ø¼±°ü) ¢º CSD : Constant Speed Drive unit (Á¤¼Ó ±¸µ¿ÀåÄ¡) ¢º CSWR : Current Standing Wave Ratio (Àü·ù Á¤ÀçÆÄ ºñ) ¢º CT : Current Transformer (°è±â¿ë º¯·ù±â) ¢º CTD : Charge Transfer Logic (ÀüÇÏ Àü¼Û ¼ÒÀÚ) ¢º CTL : Complementary Transistor Logic (»óº¸ Æ®·£Áö½ºÅÍ ³í¸®) ¢º CTR : Critical Temperature Resistor (ÀÓ°è ¿Âµµ ÀúÇ×±â) ¢º CVCF : Constant Voltage Constant Frequency (Á¤Àü¾Ð Á¤ÁÖÆÄ Àü¿ø) ¢º CVD : Chemical Vapor Deposition method (ÈÇÐ ±â»ó ¼ºÀå¹ý)
D
¢º DAC : Digital Analog Converter (µðÁöÅÐ ¾Æ³ª·Î±× º¯È¯±â) ¢º DAS : Distribution Automation System (¹èÀüÀÚµ¿È ½Ã½ºÅÛ) ¢º dB : Decibel ¢º DC : Direct Current (Á÷·ù) ¢º DCS : Distributed Control System (ºÐ»ê Á¦¾î ½Ã½ºÅÛ) ¢º DDC : Direct Digital Control (Á÷Á¢ µðÁöÅÐ Á¦¾î) ¢º DF : Dumping Factor (Á¦µ¿ °è¼ö) ¢º DG : Differential Gain (¹ÌºÐ À̵æ) ¢º DG/DF : Differential Gain/Differential Phase (¹ÌºÐ À̵æ/¹ÌºÐ À§»ó) ¢º DH : Double Heterostructure (´õºí ÇìÅ×·Î Á¢ÇÕ) ¢º DIN : Deutsches Institut fur Normung (µ¶ÀÏ ±¹°¡ ±Ô°Ý) ¢º DNC : Direct Numerical Control (Á÷Á¢ ¼öÄ¡ Á¦¾î) ¢º DP : Differential Phase (¹ÌºÐ À§»ó) ¢º DPCM : Differential Pulse Code Modulation (ó¬Ý ÆÞ½º ºÎÈ£ º¯Á¶¹æ½Ä) ¢º DPSK : Differential Phase Shift Keying (ó¬Ý À§»ó ½ÃÇÁÆ® Å°À×) ¢º DSM :Demand Side Management ¢º DSP : Digital Signal Processor (µðÁöÅÐ ½Åȣó¸® ÀåÄ¡) ¢º DVM : Digital Voltmeter (µðÁöÅÐ Àü¾Ð°è) ¢º DYNAMO : Dynamic Model (´ÙÀ̳ª¸ð, ¿¬¼Ó ½Ã½ºÅÛ ½Ã¹Ä·¹ÀÌÅÍÀÇ Çϳª)
E
¢º EBM : Electron Beam Machining (ÀüÀÚ ºö °¡°ø) ¢º EC : Electronic Commerce (ÀüÀÚ »ó°Å·¡) ¢º ECCS : Electronic Concentrated Engine Control System (ÀüÀÚ ÁýÁß ¿£ÁøÁ¦¾î ½Ã½ºÅÛ) ¢º ECG : Electrocardiogram (½ÉÀüµµ) ¢º ECTL : Emitter Coupled Transistor Logic (À̹ÌÅÍ Æ®·£Áö½ºÅÍ ³í¸®È¸·Î) ¢º EDM : Electrical Discharging Machining (¹æÀü °¡°ø) ¢º EDR : Equivalent Direct Radiation (ßÓÓ× ¹æ¿ ¸éÀû) ¢º EGE system : Engine 1, 2´ë¸¦ ±¸µ¿ÇÏ¿© ±³·ùÃâ·Â ¹ß»ý (¹«Á¤Àü Àü¿øÀåÄ¡ÀÇ ÇÑ ¹æ½Ä) ¢º EG-MG system : Engine-Magnet(¹«Á¤Àü Àü¿øÀåÄ¡ÀÇ ÇÑ ¹æ½Ä) ¢º EIA : Electronic Industrial Association (¹Ì±¹ ÀüÀÚ °ø¾÷ȸ) ¢º EIRP : Effective Isotropically Radiated Power(½ÇÈ¿ µî¹æ ¹æ»ç Àü·Â) ¢º EL : Electroluminescence (ÀüÀÚ ¹ß±¤) ¢º EMC : Electromagnetic Compatibility (ÀüÀÚÀû Á¢ÇÕ¼º) ¢º EMF : Electromotive Force (±âÀü·Â) ¢º EMG system : EMG ¹æ½Ä (Three Engine system) ¢º EMI : Electromagnetic Interference (ÀüÀڱ⠹æÇØ) ¢º EMS : Energy Management System (Áß¾Ó ±ÞÀü ½Ã½ºÅÛ) ¢º EPIRB : Emergency Position Indicating Radio Beacon (ºñ»ó¿ë À§Ä¡Ç¥½Ã ¹«¼±ÀåÄ¡) ¢º ERP : Effective Radiation Power (½ÇÈ¿ ¹æ»ç Àü·Â) ¢º ESP : Electron Spin Resonance (ÀüÀÚ ½ºÇÉ °ø¸í) ¢º EWS : Engineering Workstation
F
¢º FA : Factory Automation (°øÀå ÀÚµ¿È) ¢º FCI : Flux Changes per Inch (¸Å ÀÎÄ¡ ´ç ÀÚ¼Ó ¹ÝÀü¼ö) ¢º FD : Floppy Disk ¢º FDM : Frequency Division Multiplex communication (ÁÖÆļö ºÐÇÒ ´ÙÁß Åë½Å) ¢º FDMA : Frequency Division Multiplex Access (ÁÖÆļö ºÐÇÒ ´Ù¿ø Á¢¼Ó) ¢º FEC : Forward Error Correction (¼ø¹æÇâ ¿À·ù Á¤Á¤¹ý) ¢º FCC : Federal Communication Commission (¹Ì±¹ ¿¬¹æ Åë½Å À§¿øȸ) ¢º FET : Field Effect Transistor (Àü°è È¿°ú Æ®·£Áö½ºÅÍ) ¢º FG : Frame Ground (ÇÁ·¹ÀÓ Á¢Áö) ¢º FGA : Floating Gate Amplifier (ºÎµ¿ °ÔÀÌÆ® ÁõÆø±â) ¢º FM : Frequency Modulation (ÁÖÆļö º¯Á¶) ¢º FMEA : Failure Mode Effect Analysis (°íÀå ¸ðµå È¿°ú Çؼ®) ¢º FMS : Flexible Manufacturing System (´ÙÇ°Á¾ ¼Ò·® »ý»ê ½Ã½ºÅÛ) ¢º FOT : Frequency of Optimum Traffic (ÃÖÀû »ç¿ë ÁÖÆļö) ¢º FRP : Fiber glass Reinforced Plastics (À¯¸®¼¶À¯ °È Çöó½ºÆ½) ¢º FSK : Frequency Shift Keying (ÁÖÆļö ÆíÀÌ ¹æ½Ä) ¢º FSS : Flying Spot Scanner (Þ«ïÇ ÁÖ»ç ÀåÄ¡) ¢º FTC : Fast Time-constant Circuit (¼Ò ½Ã»ó¼ö ȸ·Î) ¢º FTTH : Fiber to the Home
G
¢º Ga-As : Gallium Arsenide (°¥·ý ºñ¼Ò) ¢º GCA : Ground Control Approach (Áö»ó °üÁ¦ ÁøÀÔ ÀåÄ¡) ¢º GCB : Gas Circuit Breaker (°¡½º Â÷´Ü±â) ¢º GCR : Group Coded Recording (±º ºÎÈ£ ±â·Ï) ¢º GCS : Gate Controlled Switch (°ÔÀÌÆ® Á¦¾î ½ºÀ§Ä¡) ¢º GGG : Godolinium Gallium Garnet (°¡µ¹¸®´½ °¥·ý °¡´Ö, °¥·ýÀÇ ÀÏÁ¾) ¢º GIS : Gas Insulated Switchgear (°¡½º Â÷´Ü±â) ¢º GND : Ground (°¥·ý ºñ¼Ò ºÎ¼º ÀúÇ× ´ÙÀÌ¿Àµå) ¢º GPI : Ground Position Indicator (´ëÁö À§Ä¡ Ç¥½Ã±â) ¢º GPIB : General Purpose Interface Bus (¹ü¿ë ÀÎÅÍÆäÀ̽º ¹ö½º) ¢º GPS : Global Positioning System (¹ü¿ë Áö±¸ ÃøÀ§ ½Ã½ºÅÛ) ¢º GPSS : General Purpose System Simulator (¹ü¿ë ½Ã½ºÅÛ ½Ã¹Ä·¹ÀÌÅÍ) ¢º GPTE : General Purpose Test Equipment (¹ü¿ë ½ÃÇè ÀåÄ¡) ¢º GPWS : Ground Proximity Warning System (Áö»ó Á¢±Ù °æº¸ ÀåÄ¡) ¢º GSR : Grounding Short Circuit Relay (ÀÌ»ó Áö¶ô °ËÃâ °èÀü±â) ¢º G/T : Gain over Temperature (À̵æ ÃÊ°ú ¿Âµµ) ¢º GTO : Gate Turn Off thyristor (°ÔÀÌÆ® ÅÏ¿ÀÇÁ »çÀ̸®½ºÅÍ)
H
¢º HA : Home Automation (°¡Á¤ ÀÚµ¿È) ¢º HBT : Hetero Bipolar Transistor (ÇìÅ׷ιÙÀÌÆú¶ó Æ®·£Áö½ºÅÍ) ¢º HDD : Hard Disk Drive ¢º HEMT : High Electron Mobility Transformer ¢º HF : High Frequency (°íÁÖÆÄ) ¢º HIC : Hybrid IC (È¥¼º ÁýÀû ȸ·Î) ¢º Hi-Fi : High-Fidelity (°íÃæ½Çµµ) ¢º HMI : Human Machine Interface ¢º HTL : High Level Transistor (°í¼öÁØ Æ®·£Áö½ºÅÍ ³í¸®) ¢º HUD : Headup Display ¢º Hz : Hertz
I
¢º IA : Isolation Amplifier (¾ÆÀַ̼¹ÀÌ¼Ç ÁõÆø±â) ¢º IAEA : International Atomic Energy Association (±¹Á¦¿øÀÚ·Â ±â°ü) ¢º IAGC : Instantaneous Automatic Gain (¼ø½Ã ÀÚµ¿ À̵æ Á¶Àý) ¢º IARU : International Amateur Radio Union (±¹Á¦ ¾Æ¸¶Ãò¾î ¹«¼±Çùȸ) ¢º IBS : INTELSAT Business Service, Intelligent Building System ¢º ICT : Insulating Core Transformer (Àý¿¬ ö½É º¯¾Ð±â) ¢º IDF : Intermediate Distributing Frame (Áß°£ ¹è¼±ÆÇ) ¢º IE : Industrial Engineering (»ê¾÷°øÇÐ) ¢º IEC : International Electrotechnical Commission (±¹Á¦ Àü±â Ç¥ÁØ È¸ÀÇ) ¢º IEEE : Institute of Electrical and Electronic Engineers (Àü±â ÀüÀÚ ÇÐȸ) ¢º IF : Intermediate Frequency (Áß°£ ÁÖÆļö) ¢º IFRB : International Frequency Registration Board (±¹Á¦ ÁÖÆļö µî·Ï À§¿øȸ) ¢º IFT : Intermediate Frequency Transformer (Áß°£ ÁÖÆÄ Æ®·£½º) ¢º IGBT : Insulated Gate Bipolar Transistor (°íÀü·Â ½ºÀ§Äª¿ë ¹ÝµµÃ¼) ¢º IGFET : Insulated Gate FET (Àý¿¬ °ÔÀÌÆ® FET) ¢º ILD : Injection laser Diode (ÁÖÀÔÇü ·¹ÀÌÀú ´ÙÀÌ¿Àµå) ¢º IM : Induction Motor (À¯µµ Àüµ¿±â), Integration Motor (ÀûºÐ ¸ðÅÍ) ¢º INMARSAT : International Marine Satellite Consortium (±¹Á¦ úÞÀ À§¼º ±â±¸) ¢º INS : Inertial Navigation System (°ü¼º Ç×¹ý ÀåÄ¡) ¢º IOCS : Input Output Control System (ÀÔÃâ·Â Á¦¾î ½Ã½ºÅÛ) ¢º IP : Integer Programming (Á¤¼ö °èȹ¹ý), Information Provider (Á¤º¸ Á¦°øÀÚ) ¢º IPL : Initial Program Loader (Ãʱâ ÇÁ·Î±×·¥ ÀûÀç±â) ¢º IR : Infrared (Àû¿Ü¼±) ¢º IRS : Inertial Reference System (°ü¼º ±âÁØ ÀåÄ¡) ¢º ISDN : Integrated Services Digital Broadcasting (Á¾ÇÕ Á¤º¸ Åë½Å¸Á) ¢º ISO : International Organization for Standardization (±¹Á¦ Ç¥ÁØÈ ±â±¸) ¢º ISU : International System of Units (±¹Á¦ ´ÜÀ§°è) ¢º ITCG : International Telecommunication Convention Geneva (±¹Á¦ Àü±â Åë½Å Á¶¾à) ¢º ITDM : Intelligent Time Division Multiplexing (Áö´É ½ÃºÐÇÒ ´ÙÁßÈ) ¢º ITU : International Telecommunication Union (±¹Á¦ Àü±â Åë½Å ¿¬ÇÕ) ¢º I©÷L : Integrated Injection Logic (Á÷Á¢ ÁÖÀÔ ³í¸® ȸ·Î)
J
¢º JFET : Junction FET (Á¢ÇÕÇü FET) ¢º JIS : Japanese Industrial Standards (ÀϺ» °ø¾÷ ±Ô°Ý)
K
¢º KDP : Kalium Dihydrogen Phosphate (Àλê 2¼ö¼Ò Ä®·ý) ¢º KODAS : Korea Distribution Automation System (Çѱ¹Çü ¹èÀüÀÚµ¿È ½Ã½ºÅÛ) ¢º KS : Korean Standards (Çѱ¹ °ø¾÷ ±Ô°Ý) ¢º KSR : Keyboard Send/Receive set (°Ç¹Ý ¼Û¼ö½Å ÀåÄ¡) ¢º KTN : Kalium Tantalum Niobate (Ä®·ý źŻ·ý ´Ï¿Àºê) ¢º kVA : Kilovolt Ampere ¢º kW : Kilowatt ¢º kWh : Kilowatt Hour
L
¢º LA : Laboratory Automation (½ÇÇè½Ç ÀÚµ¿È) ¢º LAN : Local Area Network (±Ù°Å¸® Åë½Å¸Á) ¢º LANER : Light Activated Negative Emitter Resistance (·¡³Ê, GNDÀÇ ÀÏÁ¾, °¡½Ã±¤¼±À» ¹ß±¤Çϴ°Í) ¢º LAS : Light Activated Switch (±¤ ½ºÀ§Ä¡) ¢º LASCR : Light Activated Silicon Controlled Rectifier (±¤ SCR) ¢º LCD : Liquid Crystal Display (¾×Á¤ Ç¥½Ã ÀåÄ¡) ¢º LCU : Line Control Unit (ȸ¼± Á¦¾î À¯´Ö) ¢º LD : Laser Diode, Laser Disk ¢º LDV : Laser Doppler Velocimeter (·¹ÀÌÀú µµÇ÷¯ ¼Óµµ°è) ¢º LED : Light Emitting Diode (¹ß±¤ ´ÙÀÌ¿Àµå) ¢º LF : Low Frequency (ÀúÁÖÆÄ) ¢º LID : Leadless Inverted Device (Á÷°á ¹ÝÀü µð¹ÙÀ̽º) ¢º LNA : Low Noise Amplifier (ÀúÀâÀ½ ÁõÆø±â) ¢º LSI : Large Scale Integration (´ë±Ô¸ð ÁýÀû ȸ·Î) ¢º LSTTL : Low power Shottky Transistor Transistor Logic ¢º LUF : Lowest Usable Frequency (ÃÖÀú »ç¿ë ÁÖÆļö)
M
¢º MADT : Micro Alloy Diffused Transistor (¸¶ÀÌÅ©·Î ¾Ù·ÎÀÌ È®»êÇü Æ®·£Áö½ºÅÍ), Mean Actual Down Town (Æò±Õ Á¤Áö ½Ã°£) ¢º MAN : Medium Area Network (Áß±Ô¸ð Áö¿ª Åë½Å¸Á) ¢º MAP : Manufacturing Automation Protocol (Á¦Á¶ ÀÚµ¿È ÇÁ·ÎÅäÄÝ) ¢º MBB Contact: Make Before Break Contact (MBB Á¢Á¡) ¢º MBE : Molecular Beam Epitaxy (ºÐÀÚ¼± ¿¡ÇÇŹ½Ã) ¢º MCCB : Metal Clad Circuit Breaker ¢º MCSG : Metal Clad Switch-Gear ¢º MBM : Magnetic Bubble Memory (Àڱ⠹öºí ±â¾ïÀåÄ¡) ¢º MDF : Main Distribution Frame (Áֹ輱¹Ý) ¢º MDI : Magnetic Direction Indicator (Àڱ⠹æÇâ Áö½Ã±â) ¢º MDS : Microcomputer Development System (¸¶ÀÌÅ©·Î ÄÄÇ»ÅÍ °³¹ß ½Ã½ºÅÛ) ¢º ME : Medical Electronics (ÀÇ¿ë ÀüÀÚ°øÇÐ), Micro Electronics, Molecular Electronics ¢º MES-FET : Metal Semiconductor Field-Effect Transistor (±Ý¼Ó¹ÝµµÃ¼ È¿°ú Æ®·£Áö½ºÅÍ) ¢º MF : Medium Frequency wave (ÁßÆÄ) ¢º MHD Generation : Magneto Hydrodynamics Generation (ÀüÀÚ À¯Ã¼ ¿ªÇÐ ¹ßÀü) ¢º MICR : Magnetic Ink Character Reader (ÀÚ±â À×Å© ¹®ÀÚ Æǵ¶ÀåÄ¡) ¢º MIS : Management Information System (°æ¿µ Á¤º¸ ½Ã½ºÅÛ) ¢º MISIC : Metal Insulated Semiconductor IC (¹Ì½º IC, ±Ý¼Ó Àý¿¬ ¹ÝµµÃ¼ ÁýÀû ȸ·Î) ¢º MKS units : Meter Kilogram Second (MKS ´ÜÀ§°è) ¢º MKSA : Meter Kilometer Second Ampere (MKS ´ÜÀ§°è¿¡ Àü·ùÀÇ ´ÜÀ§ ¾ÏÆä¾î¸¦ ´õÇÑ ÀüÀڱ⠴ÜÀ§) ¢º MMIC : Monolithic Microwave IC (¸ð³ë¸®½Ä ¸¶ÀÌÅ©·ÎÆÄ ÁýÀûȸ·Î) ¢º MNOS : Metal Nitride Oxide Semiconductor (±Ý¼Ó ÁúÈ »êȸ· ¹ÝµµÃ¼) ¢º MOCVD : Organometallic Compound CVD (À¯±â ±Ý¼Ó CVD¹ý) ¢º MOS : Metal Oxide Semiconductor (±Ý¼Ó »êȸ· ¹ÝµµÃ¼) ¢º MOS FET : ±Ý¼Ó »êȸ· ¹ÝµµÃ¼ Àü°èÈ¿°ú ¢º MPU : Microprocessor Unit ¢º MTBF : Mean Time Between Failure (Æò±Õ °íÀå °£°Ý ½Ã°£) ¢º MTE : Mean Time between Error (Æò±Õ ¿À·ù½Ã°£) ¢º MTTF : Mean Time To Failure (Æò±Õ °íÀå ½Ã°£) ¢º MTTR: Mean Time To Repair (Æò±Õ ¼ö¸® ½Ã°£) ¢º MUF : Maximum Usable Frequency (ÃÖ°í »ç¿ë ÁÖÆļö) ¢º MUT : Mean Up Time (Æò±Õ µ¿ÀÛ ½Ã°£) ¢º MUX : Multiplex (´ÙÁßÈ)
N
¢º n : Nano ¢º NTSC System: National Television System Committee System (NTSC TV ¹æ¼Û¹æ½Ä) ¢º NC : Numerical Control (¼öÄ¡ Á¦¾î) ¢º NCU : Network Control Unit (¸Á Á¦¾î ÀåÄ¡) ¢º NdPP : Neodymium Pentaphosphate (5ÀÎÈ ³×³ëµð¿ò, °í´É·ü °íü ·¹ÀÌÀú¿¡ »ç¿ë) ¢º NFB : No Fuse Breaker (¹è¼±¿ë Â÷´Ü±â) ¢º NIS : National Information System (±¹°¡ Á¤º¸ ½Ã½ºÅÛ) ¢º NMR : Nuclear Magnetic Resonance (ÇÙ Àڱ⠰ø¸í) ¢º NRZ : Non Return to Zero (ºñ º¹±Í±â·Ï) ¢º NRZI : Non Return to Zero Inverted (ºñ Á¦·Î º¹±Í ¹ÝÀü)
O
¢º OA : Office Automation (»ç¹« ÀÚµ¿È) ¢º OBD : Optical Bistable Device (±¤2¾ÈÁ¤ ¼ÒÀÚ) ¢º OCB : Oil Circuit Breaker (À¯ÀÔ Â÷´Ü±â) ¢º OCR : Optical Character Recognition (±¤ÇÐ½Ä ¹®ÀÚÀνÄ) ¢º OCS : Operation Control System ¢º OEIC : Optoelectronics Integrated Circuit (±¤ÀüÀÚ ÁýÀû ȸ·Î) ¢º OEM : Original Equipment Manufacturing (ÁÖ¹®ÀÚ »óÇ¥ ºÎÂø »ý»êÀÚ) ¢º OF Cable : Oil Filled Cable ¢º OFT : Optical Fiber Tube (±¤ ¼¶À¯°ü) ¢º OLTC : On Load Tap Changer (ºÎÇϽà ÅÇ ÀüȯÀåÄ¡, º¯¾Ð±â¿¡ »ç¿ë) ¢º OLTS : On Line Test System ¢º OLVR : On Load Voltage Regulator (ºÎÇϽà Àü¾ÐÁ¶Á¤±â) ¢º OMR : Optical Mark Reader (±¤ÇÐ½Ä ¸¶Å© Æǵ¶ÀåÄ¡) ¢º OMS : Ovonic Memory Switch ¢º OPC : Organic Photoconductive Cell (À¯±â ±¤µµÀüü) ¢º OPT : Out Put Transformer (Ãâ·Â º¯¼º±â) ¢º OR : Operating Register (¹ßÁø ·¹Áö½ºÅÍ) ¢º OT : Output Trunk (Ãâ·Â Æ®··Å©) ¢º OTF : Optical Transfer Function (±¤ÇÐÀû Àü´ÞÇÔ¼ö) ¢º OTL : Output Transformerless (¹«º¯¼º Ãâ·Â) ¢º OCGR : Over Current Ground Relay (°úÀü·ù Á¢Áö °èÀü±â) ¢º OCR : Over Current Relay (°úÀü·ù °èÀü±â) ¢º OL : Over Load (°úºÎÇÏ) ¢º OLR : Over Load Relay (°úºÎÇÏ °èÀü±â) ¢º OVR : Over Voltage Relay (°úÀü¾Ð °èÀü±â) ¢º OWF : Optimum Working Frequency (ÃÖÀû ÁÖÆļö »ç¿ë)
P
¢º PABX : Private Automatic Exchanger (±¸³» ÀÚµ¿ ±³È¯±â) ¢º PAL system : Phase Alternating by Line system (PAL TV ¹æ¼Û¹æ½Ä) ¢º PAM : Pulse Amplitude Modulation (ÆÞ½º ÁøÆø º¯Á¶) ¢º PCB : Printed Circuit Board (ÇÁ¸°Æ® ¹è¼± ȸ·Î¿ë ±âÆÇ) ¢º PCM : Pulse Code Modulation (ÆÞ½º ºÎÈ£ º¯Á¶) ¢º PCS : Punch Card System (õ°ø Ä«µå ½Ã½ºÅÛ) ¢º PDM : Pulse Duration Modulation (ÆÞ½º Áö¼Ó º¯Á¶) ¢º PDP : Plasma Display Panel ¢º PE : Power Electronics ¢º PF : Power Factor (¿ª·ü) ¢º pF : pico Farad (¿ë·® ´ÜÀ§) ¢º PFM : Pulse Frequency Modulation (ÆÞ½º ÁÖÆļö º¯Á¶) ¢º PHS : Personal Handyphone System ¢º PIV : Peak Inverse Voltage (ÇÇÅ© ¿ªÀü¾Ð) ¢º PLC : Programmable Logic Controller ¢º PM : Phase Modulation (À§»ó º¯Á¶) ¢º PNM : Pulse Number Modulation (ÆÞ½º¼ö º¯Á¶) ¢º PT : Potential Transformer (°è±â¿ë º¯¾Ð±â) ¢º PPM : Pulse Phase Modulation (ÆÞ½º À§»ó º¯Á¶) ¢º PR : Protective Ratio (º¸È£ºñ) ¢º PSK : Phase Shift Keying (À§»ó ø¶ì¹ ¹æ½Ä) ¢º PTM : Pulse Time Modulation (ÆÞ½º ½Ã°£ º¯Á¶) ¢º PWM : Pulse Width Modulation (ÆÞ½º Æø º¯Á¶)
Q
¢º QAM : Quadrature Amplitude Modulation (Á÷±³ ÁøÆø º¯Á¶) ¢º QED : Quantum Electro Dynamics (¾çÀÚ ÀüÀÚ±âÇÐ)
R
¢º RAM : Read Access Memory ¢º RCTL : Resistor Condenser Transistor Logic (ÀúÇ× Äܵ§¼ Æ®·£Áö½ºÅÍ ³í¸®È¸·Î) ¢º RDF : Radio Direction Finder (¹«¼± ¹æÀ§ ÃøÁ¤±â) ¢º RF : Radio Frequency (¹«¼± ÁÖÆļö) ¢º RIF : Radio Influence Field (¹«¼± À¯µµ°è) ¢º RMI : Radio Magnetic Indicator (¹«¼± Àڱ⠹æÀ§ Áö½ÃÀåÄ¡) ¢º RMS value : Root Mean Square value (½ÇÈ¿°ª) ¢º ROM : Read Only Memory ¢º RTCF : Real Time Control Facility (½Ç½Ã°£ 󸮱â´É) ¢º RTL : Resistor Transistor Logic (ÀúÇ× Æ®·£Áö½ºÅÍ ³í¸®È¸·Î) ¢º RTS : Request To Send (¼Û½Å ¿ä±¸)
S
¢º SAMOS : Stacked Avalanche Injection MOS (»ç¸ð½º) ¢º SAW : Surface Acoustic Wave (Âù¼º Ç¥¸éÆÄ) ¢º SCADA : Supervisory Control & Data Acquisition (Áö¿ª ±ÞÀü ½Ã½ºÅÛ) ¢º SCL transistor : Space Charge Limited transistor ¢º SCR : Silicon Controlled Rectifier (½Ç¸®ÄÜ Á¦¾î Á¤·ù±â) ¢º SCS : Silicon Controlled Switch (½Ç¸®ÄÜ Á¦¾î ½ºÀ§Ä¡) ¢º SEC : Secondary Electron Conduction (2Â÷ ÀüÀÚ µµÀüÀÛ¿ë) ¢º SI : System Integration ¢º SiC : Silicon Carbide (ÅºÈ ±Ô¼Ò) ¢º SIP : Single In-line Package ¢º SIT : Silicon Intensifier Target tube (SIT °ü), Static Induction Transistor (Á¤ÀüÀ¯µµÇü Æ®·£Áö½ºÅÍ) ¢º SOI : Semiconductor On Insulator (Àý¿¬ ±âÆÇ»óÀÇ ¹ÝµµÃ¼) ¢º SPST : Single Pole Single Throw (´Ü±Ø ´ÜÅõ °³Æó±â) ¢º SQUID : Super Conducting Quantum Interference Device (½ºÄûµå) ¢º S/S : Substation (º¯Àü¼Ò) ¢º SS cable : Self Supporting cable (ÀÚ±âÁöÁöÇü °¡°ø ÄÉÀ̺í) ¢º SSG : Standard Signal Generator (Ç¥ÁؽÅÈ£ ¹ß»ý±â) ¢º SSPG : Spread Solar Power Generator (À§¼º ÅÂ¾ç ¹ßÀü) ¢º STC : Sensitivity Time Control (°¨µµÀÇ ½Ã°£ Á¶Á¤)
T
¢º TBC : Time Base Correction (½Ã°£Ãà ±³Á¤ÀåÄ¡) ¢º TC : Transmission Control (Àü¼ÛÁ¦¾î) ¢º TCM : Time Compression Multiplexing (½ÃºÐÇÒ ¹æÇâ Á¦¾î Àü¼Û¹æ½Ä) ¢º TCU : Transmission Control Unit (Àü¼ÛÁ¦¾îÀåÄ¡) ¢º TD : Transmitter Distributor (ÀÚµ¿ ¼Û½Å±â) ¢º TDM : Time Division Multiplex (½ÃºÐÇÒ ´ÙÁß¹æ½Ä) ¢º TDMA : Time Division Multiple Access (½ÃºÐÇÒ ´Ù¿ø Á¢¼Ó) ¢º TED : Transfer Electron Device ¢º TFT : Thin Film Transistor (¹Ú¸· Æ®·£Áö½ºÅÍ) ¢º TG : Turbine Generator (Åͺó ¹ßÀü±â) ¢º TGC : Triglycine Sulfate (Ȳ»ê Æ®¸®±Û¸®½Å) ¢º TGS : Triglysine Sulphate (Ȳ»ê Æ®¸®±Û¸®½Å) ¢º TSC : Thermally Stimulated Current (¿ÀÚ±Ø Àü·ù) ¢º TSI : Threshold Signal to Interface ratio (ÀÓ°è½ÅÈ£ ´ë ¹æÇØ ½ÅÈ£ºñ), Time Slot Interchange (ŸÀÓ ½½·Ô ±³È¯) ¢º TSL : Three State Logic ¢º TSS : Time Sharing System (½ÃºÐÇÒ ¹æ½Ä) ¢º TTL : Transistor Transistor Logic ¢º TWT : Travelling Wave Tube (ÁøÇàÆÄ°ü)
U
¢º UHF : Ultra High Frequency (±ØÃÊ´ÜÆÄ) ¢º UJT : Uni-Junction Transistor (´ÜÁ¢ÇÕ Æ®·£Áö½ºÅÍ) ¢º UPS : Uninterruptible Power Supply (¹«Á¤Àü Àü¿øÀåÄ¡)
V
¢º VAC : Volts Alternating Current (±³·ùÀü¾Ð) ¢º VCB : Vacuum Circuit Breaker (Áø°ø Â÷´Ü±â) ¢º VEF : Vacuum Electric Furnace (Áø°ø Àü±â·Î) ¢º VI : Vacuum Interrupter (Áø°ø ÀÎÅÍ·´ÅÍ) ¢º VPI : Vacuum Pressure Impregnation (Áø°øÇÔħ) ¢º VAN : Value Added Network (ºÎ°¡°¡Ä¡ Åë½Å¸Á) ¢º VVVF : Variable Voltage Variable Frequency (°¡º¯ Àü¾Ð °¡º¯ ÁÖÆļö) ¢º VCM : Voice Coil Motor ¢º VCO : Voltage Controlled Oscillator (Àü¾ÐÁ¦¾î ¹ßÁø±â) ¢º VDT : Visual Display Terminal (¿µ»ó Ç¥½Ã ´Ü¸»ÀåÄ¡) ¢º VF Converter : Voltage Frequency Converter (Àü¾Ð ÁÖÆļö º¯È¯±â) ¢º VFD : Visual Fluorescent Display (°¡½ÃÇü±¤ Ç¥½ÃÀåÄ¡) ¢º VFO : Variable Frequency Oscillator (°¡º¯ ÁÖÆļö ¹ßÁø±â) ¢º VHF : Very High Frequency (ÃÊ´ÜÆÄ) ¢º VRS : Video Response System (È»ó ÀÀ´ä ½Ã½ºÅÛ) ¢º VSB : Vestigial Side Band (ÀÜ·ù ÃøÆÄ´ë) ¢º VSWR : Voltage Standing Wave Ratio (Àü¾Ð Á¤ÀçÆĺñ) ¢º VTVM : Vacuum Tube Volt Meter (Áø°ø°ü Àü¾Ð°è) ¢º VU : Volume Unit (À½·® ´ÜÀ§)
W
¢º WAN : Wide Added Network (±¤¿ª Åë½Å¸Á) ¢º WDM : Wavelength Division Multiplexing (ÆÄÀå ´ÙÁß ºÐÇÒ)
X
¢º XMT : Transmit (¼Û½Å) ¢º XUV : Extreme Ultraviolet radiation (±ØÀڿܼ±)
Y
¢º YAG : Yttrium Aluminum Garnet (ÀÌÆ®·ý ¾Ë·ç¹Ì´½ °¡´Ö) ¢º YIG : Yttrium Iron Garnet (ÀÌÆ®·ý ö °¡´Ö)
[ÀÌ °Ô½Ã¹°Àº ¿î¿µÀÚ´Ô¿¡ ÀÇÇØ 2013-12-22 22:14:25 Âü°íÀÚ·á¿¡¼ À̵¿ µÊ]
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